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TC = 100�C
1�5
10000
1�0
1000
0�5
TC = -40�C
VCE = 3 V TC = 25�C
tp = 300 �s, duty cycle
100 0
0�5 1�0 10 20 0�5 1�0 10 20
IC - Collector Current - A IC - Collector Current - A
Figure 1. Figure 2.
BASE-EMITTER SATURATION VOLTAGE
vs
COLLECTOR CURRENT
TCS140AI
3�0
TC = -40�C
TC = 25�C
2�5 TC = 100�C
2�0
1�5
1�0
0�5
IB = IC / 100
tp = 300 �s, duty cycle
0�5 1�0 10 20
IC - Collector Current - A
Figure 3.
PRODUCT I NF ORMAT I ON
3
FE
h
- Typical DC Current Gain
CE(sat)
V
- Collector-Emitter Saturation Voltage - V
BE(sat)
V
- Base-Emitter Saturation Voltage - V
BDW83, BDW83A, BDW83B, BDW83C, BDW83D
NPN SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
SAS140AB
100
10
1�0
BDW83
BDW83A
BDW83B
BDW83C
BDW83D
0�1
1�0 10 100 1000
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
TIS140AB
160
140
120
100
80
60
40
20
0 25 50 75 100 125 150
TC - Case Temperature - �C
Figure 5.
PRODUCT I NF ORMAT I ON
4
C
I - Collector Current - A
tot
P
- Maximum Power Dissipation - W
BDW83, BDW83A, BDW83B, BDW83C, BDW83D
NPN SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93
4,90
4,70
15,2 1,37
4,1
�
14,7 3,95 1,17
4,0
4,15
16,2 MAX.
12,2 MAX.
31,0 TYP.
18,0 TYP.
1 2 3
1,30 0,78
1,10 0,50
11,1
2,50 TYP.
10,8
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the mounting tab. MDXXAW
PRODUCT I NF ORMAT I ON
5
BDW83, BDW83A, BDW83B, BDW83C, BDW83D
NPN SILICON POWER DARLINGTONS
AUGUST 1978 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright � 1997, Power Innovations Limited
PRODUCT I NF ORMAT I ON
6
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.
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