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(controlled by subaddresses 84H and 85H)
V L1 P analog supply voltage for analog inputs AI1x (3.3 V)
DDA1A
AGNDA L2 P analog signal ground
AI14 L3 I analog input 14
VSSD9 L4 P digital ground 9 (peripheral cells)
V L5 P digital ground 10 (core)
SSD10
ADP6 L6 O MSB - 2 of direct analog-to-digital converted output data
(VSB)
ADP3 L7 O MSB - 5 of direct analog-to-digital converted output data
(VSB)
V L8 P digital ground 11 (peripheral cells)
SSD11
VSSD12 L9 P digital ground 12 (core)
RTCO L10 O/st/pd real-time control output; contains information about actual
system clock frequency, field rate, odd/even sequence,
decoder status, subcarrier frequency and phase and PAL
sequence; the RTCO pin is enabled via I2C-bus bit RTCE;
see notes 5, 6
V L11 P digital ground 13 (peripheral cells)
SSD13
ITRI L12 I/(O) image port output control signal, affects all input port pins
inclusive ICLK, enable and active polarity is under software
control (bits IPE in subaddress 87H); output path used for
testing: scan output
IDQ L13 O output data qualifier for image port (optional: gated clock
output)
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IGP0 L14 O general purpose output signal 0; image port (controlled by
subaddresses 84H and 85H)
AOUT M1 O analog test output (do not connect)
V M2 P ground for internal Clock Generation Circuit (CGC)
SSA0
V M3 P analog supply voltage (3.3 V) for internal clock generation
DDA0
circuit
VDDD9 M4 P
digital supply voltage 9 (peripheral cells)
V M5 P
DDD10 digital supply voltage 10 (core)
ADP7 M6 O
MSB - 1 of direct analog-to-digital converted output data
(VSB)
ADP2 M7 O
MSB - 6 of direct analog-to-digital converted output data
(VSB)
V M8 P
DDD11 digital supply voltage 11 (peripheral cells)
VDDD12 M9 P
digital supply voltage 12 (core)
RTS0 M10 O real-time status or sync information, controlled by
subaddresses 11H and 12H
V M11 P
DDD13 digital supply voltage 13 (peripheral cells)
AMXCLK M12 I
audio master external clock input
FSW M13 I/pd fast switch (blanking) with internal pull-down inserts
component inputs into CVBS signal
ICLK M14 I/O
clock output signal for image port, or optional
asynchronous back-end clock input
TEST13 N1 NC do not connect, reserved for future extensions and for testing
TEST14 N2 I/pu do not connect, reserved for future extensions and for testing
TEST15 N3 I/pd do not connect, reserved for future extensions and for testing
CE N4 I/pu chip enable or reset input (with internal pull-up)
LLC2 N5 O line-locked 1 ¤2 clock output (13.5 MHz nominal)
CLKEXT N6 I external clock input intended for analog-to-digital conversion
of VSB signals (36 MHz)
ADP5 N7 O MSB - 3 of direct analog-to-digital converted output data
(VSB)
ADP0 N8 O LSB of direct analog-to-digital converted output data (VSB)
SCL N9 I serial clock input (I 2 C-bus)
RTS1 N10 O real-time status or sync information, controlled by
subaddresses 11H and 12H
ASCLK N11 O audio serial clock output
ITRDY N12 I target ready input for image port data
TEST16 N13 NC do not connect, reserved for future extensions and for testing
TEST17 N14 NC do not connect, reserved for future extensions and for testing
TEST18 P2 I/O do not connect, reserved for future extensions and for testing
EXMCLR P3 I/pd
external mode clear (with internal pull-down)
LLC P4 O line-locked system clock output (27 MHz nominal)
RES P5 O reset output (active LOW)
ADP8 P6 O MSB of direct analog-to-digital converted output data (VSB)
ADP4 P7 O MSB - 4 of direct analog-to-digital converted output data
(VSB)
ADP1 P8 O MSB - 7 of direct analog-to-digital converted output data
(VSB)
INT_A P9 O/od I2C-bus interrupt flag (LOW if any enabled status bit has
changed)
SDA P10 I/O/od serial data input/output (I 2 C-bus)
AMCLK P11 O audio master clock output, up to 50% of crystal clock
ALRCLK P12 O/st/pd audio left/right clock output; can be strapped to supply via a
3.3 kW resistor to indicate
that the default 24.576 MHz crystal (ALRCLK = 0; internal
pull-down) has been replaced
by a 32.110 MHz crystal (ALRCLK = 1); see notes 5 and 7
TEST19 P13 I/pu do not connect, reserved for future extensions and for testing:
scan input
Notes
1. I = input, O = output, P = power, NC = not connected, st = strapping, pu = pull -up, pd = pull-down, od
= open-drain.
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2. In accordance with the IEEE1149.1 standard the pads TDI, TMS, TCK and TRST are input pads
with an internal pull-up transistor and TDO is a 3-state output pad.
3. For board design without boundary scan implementation connect the TRST pin to ground.
4. This pin provides easy initialization of the Boundary Scan Test (BST) circuit. TRST can be used to
force the Test Access Port (TAP) controller to the TEST_LOGIC_RESET state (normal operation) at
once.
5. Pin strapping is done by connecting the pin to the supply via a 3.3 º&! resistor. During the power-up
reset sequence the corresponding pins are switched to input mode to read the strapping level. For the
default setting no strapping
resistor is necessary (internal pull-down).
6. Pin RTCO operates as I 2 C-bus slave address pin; RTCO = 0 slave address 42H/43H (default);
RTCO = 1 slave address 40H/41H.
7. Pin ALRCLK: 0 = 24.576 MHz crystal (default; Philips order number 4322 143 05291); 1 = 32.110
MHz crystal
12.24. TPS72501
12.24.1. General Description
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